Semiconductor device and manufacturing method thereof

ABSTRACT

An object is to reduce leakage current and parasitic capacitance of a transistor used for an LSI, a CPU, or a memory. A semiconductor integrated circuit such as an LSI, a CPU, or a memory is manufactured using a thin film transistor in which a channel formation region is formed using an oxide semiconductor which becomes an intrinsic or substantially intrinsic semiconductor by removing impurities which serve as electron donors (donors) from the oxide semiconductor and has larger energy gap than that of a silicon semiconductor. With use of a thin film transistor using a highly purified oxide semiconductor layer with sufficiently reduced hydrogen concentration, a semiconductor device with low power consumption due to leakage current can be realized.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.12/904,565, filed Oct. 14, 2010, now allowed, which claims the benefitof a foreign priority application filed in Japan as Serial No.2009-238885 on Oct. 16, 2009, both of which are incorporated byreference.

TECHNICAL FIELD

The present invention relates to a semiconductor device including anintegrated circuit which includes a thin film transistor (hereinafter,referred to as a TFT) and a manufacturing method thereof. For example,the present invention relates to an electronic device on which asemiconductor integrated circuit is mounted as a component.

In this specification, a “semiconductor device” generally refers to adevice which can function by utilizing semiconductor characteristics; anelectro-optical device, a semiconductor circuit, an electroniccomponent, and an electronic device are all included in semiconductordevices.

BACKGROUND ART

In recent years, semiconductor devices have been developed to be used asan LSI, a CPU, or a memory. A CPU is an aggregation of semiconductorelements each provided with an electrode which is a connection terminal,which includes a semiconductor integrated circuit (including at least atransistor and a memory) separated from a semiconductor wafer.

A semiconductor circuit (IC chip) of an LSI, a CPU, or a memory ismounted on a circuit board, for example, a printed wiring board, to beused as one of components of a variety of electronic devices.

In addition, a semiconductor device capable of transmitting andreceiving data has been developed. Such a semiconductor device is calleda wireless tag, an RFID tag, or the like. Those put into practical useinclude a semiconductor circuit (IC chip) formed using an antenna and asemiconductor substrate in many cases.

A silicon-based semiconductor material has been known as a semiconductorthin film which can be applied to a thin film transistor; however, anoxide semiconductor is attracting attention as another material. As amaterial of the oxide semiconductor, zinc oxide or a material includingzinc oxide as its component is known. In addition, a thin filmtransistor including an amorphous oxide (oxide semiconductor) whoseelectron carrier concentration is lower than 10¹⁸/cm³ is disclosed(Patent Documents 1 to 3).

REFERENCE

-   [Patent Document 1] Japanese Published Patent Application No.    2006-165527-   [Patent Document 2] Japanese Published Patent Application No.    2006-165528-   [Patent Document 3] Japanese Published Patent Application No.    2006-165529

DISCLOSURE OF INVENTION

Power consumption of electronic devices in a standby period is regardedas important in addition to power consumption in an operating period.Specifically, as for portable electronic devices, to which power issupplied from battery, time of use is limited due to limited amount ofelectric power. Further, as for in-vehicle electronic devices, whenleakage current in a standby period is large, lifetime of battery may bereduced. In the case of an electric vehicle, leakage current of thein-vehicle electronic device shortens the traveling distance per acertain amount of charging.

In order to reduce power consumption, reducing leakage current in astandby period in addition to power consumption in an operating periodis effective. Although the amount of leakage current of each transistoris not large, several millions of transistors are provided in the LSI,and when the amount of leakage current of those transistors is added up,the resulting amount is by no means small. Such leakage current causesan increase in power consumption of the semiconductor device in astandby period. Although leakage current is caused by various factors,electric power can be saved in a driver circuit or the like which isused in electronic devices, if leakage current in a standby period canbe reduced.

Therefore, an object of the present invention is to reduce leakagecurrent of a transistor used for an LSI, a CPU, or a memory.

Reduction in parasitic capacitance is also effective for reduction inpower consumption in an operating period; therefore, another object ofthe present invention is to reduce power consumption by reducingparasitic capacitance.

In addition, another object of the present invention is to shorten thechannel length L of a transistor used in a semiconductor integratedcircuit such as an LSI, a CPU, or a memory, so that operation speed ofthe circuit is increased, and further, power consumption is reduced.

A semiconductor integrated circuit such as an LSI, a CPU, or a memory ismanufactured using a thin film transistor in which a channel formationregion is formed using an oxide semiconductor which becomes an intrinsicor substantially intrinsic semiconductor by removing impurities whichserve as electron donors (donors) from the oxide semiconductor and haslarger energy gap than that of a silicon semiconductor.

A highly purified oxide semiconductor layer with sufficiently reducedhydrogen concentration, in which impurities such as hydrogen or OH groupcontained are removed so that the hydrogen concentration is lower thanor equal to 5×10¹⁹/cm³, preferably lower than or equal to 5×10¹⁸/cm³ or,more preferably lower than or equal to 5×10¹⁷/cm³, is used for a thinfilm transistor, whereby an off-current of the thin film transistor isreduced. Note that the concentration of hydrogen in the oxidesemiconductor layer is measured by secondary ion mass spectrometry(SIMS).

It is preferable that when the gate voltage Vg is positive, a draincurrent Id be sufficiently large, and when the gate voltage Vg is lessthan or equal to zero, the drain current Id be zero. In a thin filmtransistor using the highly purified oxide semiconductor layer withsufficiently reduced hydrogen concentration, in the case where a drainvoltage Vd is +1V or +10V, an off-current value can be smaller than1×10⁻¹³[A] while the gate voltage Vg is in the range of −5V to −20V.

By using the thin film transistor using the highly purified oxidesemiconductor layer with sufficiently reduced hydrogen concentration, asemiconductor device whose power consumption due to leakage current islow can be realized.

The thin film transistor using the highly purified oxide semiconductorlayer with sufficiently reduced hydrogen concentration can be formedover a glass substrate, and an LSI, a CPU, or a memory can be formedthereover. By using a large-area glass substrate, manufacturing cost canbe reduced. Without being limited to a glass substrate, the thin filmtransistor using the oxide semiconductor layer with sufficiently reducedhydrogen concentration can be formed over a silicon substrate. A siliconsubstrate with high thermal conductivity is preferably used to dissipateheat from the semiconductor circuit. Alternatively, the thin filmtransistor using the oxide semiconductor layer with sufficiently reducedhydrogen concentration can be formed over a flexible substrate, forexample, a plastic film, whereby a flexible wireless tag can bemanufactured.

One of the structures of the invention disclosed in this specificationis a semiconductor device provided with a semiconductor integratedcircuit including a plurality of thin film transistors including; anoxide semiconductor layer over an insulating surface, whose hydrogenconcentration measured by secondary ion mass spectrometry is lower thanor equal to 5×10¹⁹/cm³ and carrier concentration is lower than or equalto 5×10¹⁴/cm³, a source and drain electrode layers over the oxidesemiconductor layer, a gate insulating layer over the oxidesemiconductor layer and the source and drain electrode layers, and agate electrode layer over the gate insulating layer.

With the above structure, at least one of the above problems can beresolved.

In addition, a conductive layer may be formed below the oxidesemiconductor layer. Thus, another structure of the invention is asemiconductor device including a plurality of thin film transistorsincluding; a conductive layer over an insulating surface, an insulatinglayer over the conductive layer, an oxide semiconductor layer over theinsulating layer, whose hydrogen concentration measured by secondary ionmass spectrometry is lower than or equal to 5×10¹⁹/cm³ and carrierconcentration is lower than or equal to 5×10¹⁴/cm³, a source and drainelectrode layers over the oxide semiconductor layer, a gate insulatinglayer over the oxide semiconductor layer and the source and drainelectrode layers, and a gate electrode layer over the gate insulatinglayer, wherein the conductive layer overlaps with the oxidesemiconductor layer with the insulating layer interposed therebetween.

In order to reduce parasitic capacitance, each of the above structuresfurther include an insulating layer over and in contact with the sourceand drain electrode layers, so that the source and drain electrodelayers overlap with part of the gate electrode layer with the gateinsulating layer and the insulating layer interposed therebetween. Byproviding the insulating layer over and in contact with the source anddrain electrode layers, parasitic capacitance between the gate electrodelayer and the source electrode layer and between the gate electrodelayer and the drain electrode layer can be reduced.

Further, in a wiring intersection portion, in order to reduce theparasitic capacitance, the gate insulating layer and the insulatinglayer are stacked between a gate wiring layer and a source wiring layer.An increase in the distance between the gate wiring layer and the sourcewiring layer can reduce power consumption due to parasitic capacitance,and can prevent short circuit between wirings.

Further, an EDMOS circuit can be formed by combining a plurality of thinfilm transistors using an oxide semiconductor layer with sufficientlyreduced hydrogen concentration. Such an EDMOS circuit includes a firstthin film transistor including a first oxide semiconductor layer and asecond thin film transistor including a second oxide semiconductor layerover an insulating surface, wherein the hydrogen concentration of thefirst oxide semiconductor layer and the second semiconductor layermeasured by secondary ion mass spectrometry is lower than or equal to5×10¹⁹/cm³ and the carrier concentration thereof is lower than or equalto 5×10¹⁴/cm³.

A resistor, a capacitor, an inductor, and the like can be formed overone substrate by using the oxide semiconductor layer with sufficientlyreduced hydrogen concentration. For example, the resistor can be formedby sandwiching the oxide semiconductor layer with sufficiently reducedhydrogen concentration between upper and lower electrode layers. In eachof the above structures, an oxide semiconductor layer which serves as aresistor is formed over the same substrate, between a first conductivelayer and a second conductive layer overlapping with the firstconductive layer.

In addition to an LSI, a CPU, or a memory, the thin film transistorusing the oxide semiconductor layer with sufficiently reduced hydrogenconcentration can be used for a power supply circuit, a transmitting andreceiving circuit, an amplifier of an audio processing circuit, a drivercircuit of a display portion, a controller, a converter of an audioprocessing circuit, or the like.

Alternatively, a plurality of semiconductor integrated circuits can bemounted on one package, which is a so-called MCP (Multi Chip Package),so that the semiconductor device is highly integrated.

In the case where the semiconductor integrated circuit is mounted on acircuit board, the semiconductor integrated circuit may be mounted in aface-up state or a flip-chip state (face-down state).

A thin film transistor using the oxide semiconductor layer withsufficiently reduced hydrogen concentration can extremely reduce leakagecurrent, and a semiconductor device with low power consumption can berealized by using the thin film transistor for a semiconductorintegrated circuit.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B are cross-sectional views illustrating one embodiment ofthe present invention.

FIG. 2 is an equivalent circuit diagram illustrating one embodiment ofthe present invention.

FIG. 3 is a cross-sectional view illustrating one embodiment of thepresent invention.

FIGS. 4A and 4B are respectively a cross-sectional view and a top viewillustrating one embodiment of the present invention.

FIG. 5 is a block diagram illustrating one embodiment of the presentinvention.

FIG. 6 illustrates a block diagram.

FIGS. 7A and 7B are views each illustrating a semiconductor device.

FIGS. 8A to 8C are views illustrating a semiconductor device.

FIG. 9 is a view illustrating a semiconductor device.

FIGS. 10A to 10C are views illustrating a semiconductor device.

FIGS. 11A and 11B are equivalent circuit diagrams illustrating oneembodiment of the present invention.

FIG. 12 is a diagram illustrating a band structure between a source anda drain of a MOS transistor using an oxide semiconductor.

FIG. 13 is a diagram illustrating a state in which a positive voltage isapplied to the drain side in FIG. 12.

FIGS. 14A and 14B are energy band diagrams of a MOS structure of the MOStransistor using an oxide semiconductor, illustrating a case where agate voltage is set positive and a case where the gate voltage is setnegative, respectively.

FIG. 15 is a comparative diagram illustrating a band structure between asource and a drain of a silicon MOS transistor.

FIGS. 16A and 16B are equivalent circuit diagrams illustrating oneembodiment of the present invention.

FIG. 17 is an equivalent circuit diagram illustrating one embodiment ofthe present invention.

FIGS. 18A to 18E are views, each illustrating an example of anelectronic device.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. However, the presentinvention is not limited to the description below, and it is easilyunderstood by those skilled in the art that modes and details disclosedherein can be modified in various ways without departing from the spiritand the scope of the present invention. Therefore, the present inventionis not construed as being limited to description of the embodiments.

Embodiment 1

This embodiment describes an example of a cross-sectional structure of asemiconductor integrated circuit.

In this embodiment, one embodiment of a semiconductor integrated circuitand a manufacturing method thereof is described with reference to FIGS.1A and 1B, FIG. 2, FIG. 3, and FIGS. 4A and 4B.

An example of a cross-sectional structure of the semiconductorintegrated circuit is illustrated in FIGS. 1A and 1B. A thin filmtransistor 440 illustrated in FIG. 1B is one of top-gate thin filmtransistors.

The thin film transistor 440 includes a first insulating layer 447 a, asecond insulating layer 443, a third insulating layer 447 b, an oxidesemiconductor layer 442, a first source electrode layer 445 a, a secondsource electrode layer 448 a, a first drain electrode layer 445 b, asecond drain electrode layer 448 b, a gate insulating layer 444, and agate electrode layer 441, over a substrate 430 having an insulatingsurface.

Part of the oxide semiconductor layer 442 which overlaps with the gateelectrode layer 441 is a channel formation region, and a channel lengthL1 is determined by the distance between the lower edge portion of thefirst source electrode layer 445 a and the lower edge portion of thefirst drain electrode layer 445 b which are next to each other over theoxide semiconductor layer 442.

The thin film transistor 440 is described using a single-gate thin filmtransistor; however, a thin film transistor having a multi-gatestructure in which a plurality of channel formation regions is includedcan also be used as needed.

A thin film transistor 470 with reduced parasitic capacitance can beformed over the same substrate and in the same steps as the thin filmtransistor 440.

Hereinafter, steps for manufacturing the thin film transistors 440 and470 over the substrate 430 will be described below with reference toFIG. 1A.

Although there is no particular limitation on a substrate which can beused as the substrate 430 having an insulating surface, the substrateneeds to have at least heat resistance high enough to withstand heattreatment to be performed later. As the substrate 430 having aninsulating surface, a glass substrate formed of barium borosilicateglass, alumino-borosilicate glass, or the like can be used.

In the case where a glass substrate is used and the temperature at whichthe heat treatment is to be performed later is high, a glass substratewhose strain point is greater than or equal to 730° C. is preferablyused. As a glass substrate, a glass material such as aluminosilicateglass, aluminoborosilicate glass, or barium borosilicate glass is used,for example. Note that by containing a larger amount of barium oxide(BaO) than that of boric oxide (B₂O₃), a glass substrate isheat-resistant and of more practical use. Therefore, a glass substratecontaining a larger amount of BaO than that of B₂O₃ is preferably used.

Note that instead of the above glass substrate, a substrate formed of aninsulator such as a ceramic substrate, a quartz substrate, or a sapphiresubstrate may be used. Alternatively, a crystallized glass substrate orthe like may be used. Alternatively, a semiconductor substrate includingan insulating layer on its surface, a plastic substrate, or the like canbe used as appropriate.

First, after a conductive film is formed over the substrate 430 havingan insulating surface, electrode layers 479 a, 479 b and 479 c areformed by a first photolithography step. The electrode layers 479 a, 479b and 479 c can be formed using an element selected from Al, Cr, Cu, Ta,Ti, Mo, and W, an alloy containing any of these elements, an alloy filmcontaining a combination of any of these elements, or the like. In thisembodiment, the electrode layers 479 a, 479 b and 479 c have a stackedlayer structure of a tungsten nitride layer and a tungsten layer.

Next, the first insulating layer 447 a is formed to cover the electrodelayers 479 a, 479 b and 479 c. The first insulating layer 447 a can beformed using a single-layer or stacked layers of a silicon oxide layer,a silicon nitride layer, a silicon oxynitride layer, and/or a siliconnitride oxide layer by a plasma CVD method, a sputtering method, or thelike.

Next, a spacer insulating layer is formed over the first insulatinglayer 447 a, and is selectively removed then by a secondphotolithography step to form the second insulating layer 443. Thespacer insulating layer is formed using a single layer or stacked layersof a silicon oxide layer, a silicon nitride layer, a silicon oxynitridelayer, and/or a silicon nitride oxide layer by a plasma CVD method, asputtering method, or the like. The thickness of the spacer insulatinglayer is 500 nm to 2 um, inclusive. In the same step, a fifth insulatinglayer 473 functioning as a spacer insulating layer is formed so as tooverlap with the electrode layer 479 c. In this manner, a stacked layerregion with large thickness and a single layer region with smallthickness are formed. In order to reduce parasitic capacitance, thefourth insulating layer functioning as a spacer insulating layer and thefirst insulating layer are stacked in the region with large thickness,and in order to form a storage capacitor and the like, the firstinsulating layer is provided in the region with small thickness.

Next, the third insulating layer 447 b is formed to cover the firstinsulating layer 447 a, the second insulating layer 443, and the fifthinsulating layer 473. The third insulating layer 447 b which is incontact with the oxide semiconductor layer is preferably formed using anoxide insulating layer such as a silicon oxide layer, a siliconoxynitride layer, an aluminum oxide layer, or an aluminum oxynitridelayer. As a method for forming the third insulating layer 447 b, aplasma CVD method, a sputtering method, or the like can be used;however, it is preferable that the third insulating layer 447 b beformed by a sputtering method, so that the third insulating layer 447 bdost not contain a large amount of hydrogen.

In this embodiment, a silicon oxide layer is formed as the thirdinsulating layer 447 b by a sputtering method. The substrate 430 istransferred to a treatment chamber, a sputtering gas including highlypurified oxygen from which hydrogen and moisture are removed isintroduced thereinto, and a silicon oxide layer is formed over thesubstrate 430 as the third insulating layer 447 b using a silicontarget. The temperature of the substrate 430 may be room temperature, orthe substrate 430 may be heated.

For example, a silicon oxide layer is formed by an RF sputtering methodusing quartz (preferably, synthetic quartz) in an atmosphere containingoxygen and argon (the flow rate of oxygen is 25 sccm, and the flow rateof argon is 25 sccm), under conditions where a substrate temperature is108° C., the distance between the substrate and the target (T-Sdistance) is 60 mm, the pressure is 0.4 Pa, and a high-frequency powersource is 1.5 kW. The thickness of the layer is 100 nm. Note thatinstead of quartz (preferably, synthetic quartz), a silicon target canbe used as a target for deposition of the silicon oxide layer. As thesputtering gas, oxygen or a mixed gas of oxygen and argon is used.

In this case, it is preferable that the third insulating layer 447 b beformed while moisture remaining in the treatment chamber is removed.This is so that the third insulating layer 447 b does not containhydrogen, hydroxyl, or moisture.

In order to remove moisture remaining in the treatment chamber, anadsorption type vacuum pump is preferably used. For example, a cryopump,an ion pump, or a titanium sublimation pump is preferably used. As anevacuation unit, a turbo pump provided with a cold trap may be used. Ina treatment chamber which is evacuated using a cryopump, for example,hydrogen atoms, compounds including hydrogen atoms such as water (H₂O),or the like are exhausted; thus, the concentration of impuritiescontained in the third insulating layer 447 b which is deposited in thetreatment chamber can be reduced.

Examples of a sputtering method include an RF sputtering method in whicha high-frequency power source is used for a sputtering power supply, aDC sputtering method in which a DC power source is used, and a pulsed DCsputtering method in which a bias is applied in a pulsed manner. An RFsputtering method is mainly used in the case where an insulating film isformed, and a DC sputtering method is mainly used in the case where ametal film is formed.

In addition, there is also a multi-source sputtering apparatus in whicha plurality of targets of different materials can be set. With themulti-source sputtering apparatus, films of different materials can beformed to be stacked in the same chamber, or a film of plural kinds ofmaterials can be formed by electric discharge at the same time in thesame chamber.

In addition, there are a sputtering apparatus provided with a magnetsystem inside the chamber and used for a magnetron sputtering, and asputtering apparatus used for an ECR sputtering in which plasmagenerated with the use of microwaves is used without using glowdischarge.

Furthermore, as a deposition method using sputtering, there are also areactive sputtering method in which a target substance and a sputteringgas component are chemically reacted with each other during depositionto form a thin compound film thereof, and a bias sputtering in which avoltage is also applied to a substrate during deposition.

The third insulating layer 447 b can also have a stacked layerstructure. For example, a nitride insulating layer such as a siliconnitride layer, a silicon nitride oxide layer, or an aluminum nitridelayer, and the above-described oxide insulating layer may be stacked inthis order from the substrate 430 side.

For example, a sputtering gas including high-purified nitrogen fromwhich hydrogen and moisture are removed is introduced between thesilicon oxide layer and the substrate to form a silicon nitride layerusing a silicon target. In this case, it is preferable that the siliconnitride layer be formed while moisture remaining in the treatmentchamber is removed, in a manner similar to that of the silicon oxidelayer.

Also in the case of forming the silicon nitride layer, the substrate maybe heated at the time of deposition.

In the case where the silicon nitride layer and the silicon oxide layerare stacked as the third insulating layer 447 b, the silicon nitridelayer and the silicon oxide layer can be formed in one treatment chamberusing the same silicon target. First, a sputtering gas includingnitrogen is introduced into the treatment chamber, and the siliconnitride layer is formed using a silicon target provided in the treatmentchamber. Then, the sputtering gas is switched to a sputtering gasincluding oxygen, and the silicon oxide layer is formed using the samesilicon target. The silicon nitride layer and the silicon oxide layercan be formed in succession without being exposed to air, therebypreventing impurities such as hydrogen or moisture from being adsorbedonto a surface of the silicon nitride layer.

Then, an oxide semiconductor film is formed to a thickness of greaterthan or equal to 2 nm and less than or equal to 200 nm over the thirdinsulating layer 447 b.

In addition, in order that hydrogen, hydroxyl, and moisture arecontained as little as possible in the oxide semiconductor film, it ispreferable that the substrate 430 over which the third insulating layer447 b is formed be preheated in a preheating chamber of the sputteringapparatus, so that impurities such as hydrogen or moisture absorbed ontothe substrate 430 are discharged and exhausted, as a pretreatment beforedeposition. Note that as an evacuation, a cryopump is preferablyprovided in the preheating chamber. Note also that this preheatingtreatment can be omitted in some cases.

Note that before the oxide semiconductor film is formed by a sputteringmethod, dust on a surface of the third insulating layer 447 b ispreferably removed by reverse sputtering in which an argon gas isintroduced and plasma is generated. The reverse sputtering is a methodin which voltage is applied to a substrate side without applying voltageto a target side, using a high-frequency power source to generate plasmain the vicinity of the substrate side in an argon atmosphere, so that asurface is modified. Note that instead of an argon atmosphere, anitrogen atmosphere, a helium atmosphere, an oxygen atmosphere, or thelike may be used.

The oxide semiconductor film is formed by a sputtering method. Any ofthe following is used as the oxide semiconductor film: anIn—Ga—Zn—O-based oxide semiconductor film, an In—Sn—Zn—O-based oxidesemiconductor film, an In—Al—Zn—O-based oxide semiconductor film, aSn—Ga—Zn—O-based oxide semiconductor film, an Al—Ga—Zn—O-based oxidesemiconductor film, a Sn—Al—Zn—O-based oxide semiconductor film, anIn—Zn—O-based oxide semiconductor film, a Sn—Zn—O-based oxidesemiconductor film, an Al—Zn—O-based oxide semiconductor film, anIn—O-based oxide semiconductor film, a Sn—O-based oxide semiconductorfilm, and a Zn—O-based oxide semiconductor film. In this embodiment, theoxide semiconductor film is formed by a sputtering method with the useof a target for formation of an In—Ga—Zn—O-based oxide semiconductorfilm. The oxide semiconductor film can be formed by a sputtering methodin a rare gas (typically, argon) atmosphere, an oxygen atmosphere, or amixed atmosphere including a rare gas (typically, argon) and oxygen. Inthe case of using a sputtering method, a target including SiO₂ at 2 wt %to 10 wt % inclusive may be used for deposition.

As a target for forming the oxide semiconductor film by a sputteringmethod, a target of metal oxide which contains zinc oxide as its maincomponent can be used. As another example of a target of metal oxide, anoxide semiconductor target for film formation including In, Ga, and Zn(composition ratio is In₂O₃:Ga₂O₃:ZnO=1:1:1 [molar ratio]) can be used.As an oxide semiconductor target for film formation including In, Ga,and Zn, a target having a composition ratio of In₂O₃:Ga₂O₃:ZnO=1:1:2[molar ratio], or In₂O₃:Ga₂O₃:ZnO=1:1:4 [molar ratio] can also be used.The filling rate of the oxide semiconductor target for film formation is90% to 100% inclusive, preferably, 95% to 99.9% inclusive. By using anoxide semiconductor target for film formation with high filling rate,the deposited oxide semiconductor film becomes a dense film.

The oxide semiconductor film is formed in the following manner: thesubstrate is held in the treatment chamber which is kept in a reducedpressure state, a sputtering gas from which hydrogen and moisture areremoved is introduced into the treatment chamber while removing moistureremaining therein, and the oxide semiconductor film is formed over thesubstrate 430 using metal oxide as a target. In order to remove moistureremaining in the treatment chamber, an adsorption type vacuum pump ispreferably used. For example, a cryopump, an ion pump, or a titaniumsublimation pump is preferably used. As an evacuation unit, a turbo pumpprovided with a cold trap may be used. In a treatment chamber which isevacuated using a cryopump, for example, hydrogen atoms, compoundsincluding hydrogen atoms such as water (H₂O) (more preferably, compoundsincluding carbon atoms as well), or the like are exhausted; therefore,the concentration of impurities contained in the oxide semiconductorfilm which is deposited in the treatment chamber can be reduced. Thesubstrate may be heated when the oxide semiconductor film is formed.

As one example of deposition conditions, conditions where a substratetemperature is room temperature, the distance between the substrate andthe target is 60 mm, the pressure is 0.4 Pa, and a direct-current (DC)power source is 0.5 kW, and the atmosphere is an atmosphere of oxygenand argon (the flow rate of oxygen is 15 sccm, and the flow rate ofargon is 30 sccm), are applied. It is preferable that a pulseddirect-current (DC) power supply be used because powder substances (alsoreferred to as particles or dust) can be reduced and the film thicknesscan be uniform. The thickness of the oxide semiconductor film ispreferably 5 nm to 30 nm, inclusive. Note that the appropriate thicknessvaries depending on the oxide semiconductor material used for the oxidesemiconductor film, and can be selected as appropriate according to thematerial.

Next, the oxide semiconductor film is processed into island-shaped oxidesemiconductor layers 442 and 472 in a third photolithography step (seeFIG. 1A). Further, a resist mask for forming the island-shaped oxidesemiconductor layers 442 and 472 may be formed using an ink jet method.Formation of the resist mask by an inkjet method needs no photomask;thus, manufacturing cost can be reduced.

Note that etching of the oxide semiconductor film here can be dryetching, wet etching, or both of dry etching and wet etching.

As the etching gas for dry etching, a gas containing chlorine(chlorine-based gas such as chlorine (Cl₂), boron chloride (BCl₃),silicon chloride (SiCl₄), or carbon tetrachloride (CCl₄)) is preferablyused.

Alternatively, a gas containing fluorine (fluorine-based gas such ascarbon tetrafluoride (CF₄), sulfur fluoride (SF₆), nitrogen fluoride(NF₃), or trifluoromethane (CHF₃)); hydrogen bromide (HBr); oxygen (O₂);any of these gases to which a rare gas such as helium (He) or argon (Ar)is added; or the like can be used.

As the dry etching method, a parallel plate RIE (reactive ion etching)method or an ICP (inductively coupled plasma) etching method can beused. In order to etch the films into desired shapes, the etchingcondition (the amount of electric power applied to a coil-shapedelectrode, the amount of electric power applied to an electrode on asubstrate side, the temperature of the electrode on the substrate side,or the like) is adjusted as appropriate.

As an etchant used for wet etching, a mixed solution of phosphoric acid,acetic acid, and nitric acid, an ammonia peroxide mixture (31 wt % ofhydrogen peroxide solution: 28 wt % of ammonia water: water=5:2:2), orthe like can be used. In addition, ITO07N (produced by KANTO CHEMICALCO., INC.) may also be used.

The etchant after the wet etching is removed together with the etchedmaterials by cleaning. The waste liquid including the etchant and thematerial etched off may be purified and the material may be reused. Whena material such as indium included in the oxide semiconductor layer iscollected from the waste liquid after the etching and reused, theresources can be efficiently used and the cost can be reduced.

The etching conditions (such as an etchant, etching time, andtemperature) are appropriately adjusted depending on the material sothat the material can be etched into a desired shape.

In this embodiment, the oxide semiconductor film is processed intoisland-shaped oxide semiconductor layers 442 and 472, by a wet etchingmethod using a mixed solution of phosphoric acid, acetic acid, andnitric acid as an etchant.

In this embodiment, a first heat treatment is performed on the oxidesemiconductor layers 442 and 472. A temperature of the first heattreatment is 400° C. to 750° C. inclusive, preferably higher than orequal to 400° C. and lower than the strain point of the substrate. Inthis embodiment, the substrate is introduced into an electric furnace,which is one of heat treatment apparatuses, and heat treatment isperformed at 450° C. on the oxide semiconductor layers for an hour in anitrogen atmosphere. Then, the oxide semiconductor layers are notexposed to air, which prevents reincorporation of water and hydrogeninto the oxide semiconductor layers, so that the oxide semiconductorlayers are obtained. By this first heat treatment, dehydration ordehydrogenation can be performed on the oxide semiconductor layers 442and 472.

However, the apparatus for the first heat treatment is not limited tothe electric furnace and may be provided with a device for heating anobject to be processed using heat conduction or heat radiation from aheating element such as a resistance heating element. For example, anRTA (rapid thermal anneal) apparatus such as a GRTA (gas rapid thermalanneal) apparatus, or an LRTA (lamp rapid thermal anneal) apparatus canbe used. An LRTA apparatus is an apparatus for heating an object to beprocessed by radiation of light (an electromagnetic wave) emitted from alamp such as a halogen lamp, a metal halide lamp, a xenon arc lamp, acarbon arc lamp, a high pressure sodium lamp, or a high pressure mercurylamp. A GRTA apparatus is an apparatus with which heat treatment isperformed using a high-temperature gas. As the gas, an inert gas whichdoes not react with a process object by heat treatment, such as nitrogenor a rare gas such as argon is used.

For example, as the first heat treatment, GRTA can be performed, inwhich the substrate is transferred and put in an inert gas heated to ahigh temperature of 650° C. to 700° C. to be heated for several minutes,and then, the substrate is transferred and taken out of the inert gasheated to a high temperature. By using GRTA, high-temperature heattreatment in a short time is possible.

Note that in the first heat treatment, it is preferable that water,hydrogen, and the like be not contained in the atmosphere of nitrogen ora rare gas such as helium, neon, or argon. It is preferable that thepurity of nitrogen or the rare gas such as helium, neon, or argon whichis introduced into a heat treatment apparatus be set to be 6N (99.9999%)or higher, preferably 7N (99.99999%) or higher (that is, the impurityconcentration is 1 ppm or lower, preferably 0.1 ppm or lower).

Further, the oxide semiconductor layer may be crystallized to be amicrocrystalline film or a polycrystalline film depending on a conditionof the first heat treatment or a material of the oxide semiconductorlayer. For instance, the oxide semiconductor layer may be crystallizedto be a microcrystalline semiconductor film having a degree ofcrystallization of 90% or more, or 80% or more. Further, depending onthe condition of the first heat treatment and the material of the oxidesemiconductor layer, the oxide semiconductor layer may be an amorphousoxide semiconductor film containing no crystalline component. The oxidesemiconductor layer may be an oxide semiconductor film in whichmicrocrystalline portions (each crystal grain having a diameter of 1 nmto 20 nm inclusive (typically, 2 nm to 4 nm inclusive)) are included inan amorphous oxide semiconductor in some cases.

The first heat treatment for the oxide semiconductor layer can beperformed before the oxide semiconductor film is processed into theisland-shaped oxide semiconductor layers. In that case, the substrate istaken out from the heat apparatus after the first heat treatment, andthen a photolithography step is performed.

The heat treatment having an effect of dehydration or dehydrogenation ofthe oxide semiconductor layers may be performed at any of the followingtimings: after the oxide semiconductor layers are formed; after a sourceelectrode and a drain electrode are formed over the oxide semiconductorlayer; and after a gate insulating layer is formed over the sourceelectrode and the drain electrode.

However, when a highly purified oxide semiconductor layer can beobtained by sufficiently reducing hydrogen or moisture at the time ofdeposition, the first heat treatment is not necessarily performed. Inthe case where a highly purified oxide semiconductor layer is obtainedby sufficiently reducing hydrogen or moisture at the time of deposition,the substrate is held in a treatment chamber kept in a reduced pressurestate and the substrate is heated to a temperature of higher than orequal to room temperature and lower than 400° C. Then, a sputtering gasfrom which hydrogen and moisture are removed is introduced whilemoisture remaining in the treatment chamber is removed, and an oxidesemiconductor layer is formed over the substrate using metal oxide as atarget. In a treatment chamber which is evacuated using a cryopump, forexample, hydrogen atoms, compounds including hydrogen atoms such aswater (H₂O) (more preferably, compounds including carbon atoms inaddition), or the like are exhausted; therefore, the concentration ofimpurities contained in the oxide semiconductor layer deposited in thetreatment chamber can be reduced. By performing deposition by sputteringwhile removing moisture remaining in the treatment chamber using acryopump, a substrate temperature when the oxide semiconductor layer isformed can be higher than or equal to room temperature and lower than400° C.

Next, a resist mask is formed over the third insulating layer 447 b by afourth photolithography step, and selective etching is performed so asto form an opening which reaches the electrode layer 479 a.

A conductive film is formed over the third insulating layer 447 b andthe oxide semiconductor layers 442 and 472. The conductive film may beformed by a sputtering method or a vacuum evaporation method. As amaterial of the conductive film, an element selected from Al, Cr, Cu,Ta, Ti, Mo, and W; an alloy containing any of these elements as acomponent; an alloy film containing any of these elements incombination; and the like can be given. Alternatively, one or morematerials selected from manganese, magnesium, zirconium, beryllium, andthorium can be used. Further, the metal conductive film may have asingle-layer structure or a stacked-layer structure of two or morelayers. For example, a single-layer structure of an aluminum filmincluding silicon, a two-layer structure in which a titanium film isstacked over an aluminum film, a three-layer structure in which atitanium film, an aluminum film, and a titanium film are stacked in thisorder, and the like can be given. Alternatively, a film, an alloy film,or a nitride film of a combination of Al and one or plurality ofelements selected from the followings may be used: titanium (Ti),tantalum (Ta), tungsten (W), molybdenum (Mo), chromium (Cr), neodymium(Nd), and scandium (Sc). In this embodiment, a stacked film of atitanium film (with a thickness of 10 nm to 100 nm inclusive) and analuminum film (with a thickness of 20 nm to 500 nm inclusive) is formedas the conductive film.

Next, an insulating film with a thickness of 200 nm to 2000 nm inclusiveis formed over the conductive film by a plasma CVD method, a sputteringmethod, or the like, using a single layer or stacked layers of a siliconoxide layer, a silicon nitride layer, a silicon oxynitride layer, and/ora silicon nitride oxide layer.

A resist mask is formed over the insulating film by a fifthphotolithography step, selective etching is performed to form the fourthinsulating layer 446, the first source electrode layer 445 a, the secondsource electrode layer 448 a, the first drain electrode layer 445 b, andthe second drain electrode layer 448 b, and then the resist mask isremoved. The fourth insulating layer 446 is provided in order to reduceparasitic capacitance between the gate electrode layer formed later andthe source and drain electrode layers. Note that it is preferable thatthe end portions of the source electrode layers and the drain electrodelayers be a tapered shape because coverage of the gate insulating layerstacked thereover is improved.

Note that when the conductive film is etched, each material and etchingconditions are adjusted as appropriate so that the oxide semiconductorlayers 442 and 472 are not removed so as to expose the third insulatinglayer 447 b thereunder.

In this embodiment, a Ti film is used as the first source electrodelayer 445 a and the first drain electrode layer 445 b, an aluminum filmis used as the second source electrode layer 448 a and the second drainelectrode layer 448 b, an In—Ga—Zn—O-based oxide is used as the oxidesemiconductor layer 442, and an ammonia hydrogen peroxide mixture (amixed solution of ammonia water, water, and a hydrogen peroxidesolution) is used as the etchant.

Note that in the fifth photolithography step, only part of the oxidesemiconductor layer 442 may be etched so that an oxide semiconductorlayer having a groove (a depression portion) is formed in some cases.The resist mask for forming the first source electrode layer 445 a andthe first drain electrode layer 445 b may be formed by an ink jetmethod. Formation of the resist mask by an inkjet method needs nophotomask; thus, manufacturing cost can be reduced.

In light exposure for formation of the resist mask in the fifthphotolithography step, ultraviolet light, KrF laser light, or ArF laserlight is used. A channel length L1 of the thin film transistor 440formed later is determined by the distance between the lower edgeportion of the source electrode layer and the lower edge portion of thedrain electrode layer which are next to each other over the oxidesemiconductor layer 442. In the case of performing light exposure bywhich the channel length L1 is shorter than 25 nm, light exposure forforming the resist mask in the fifth photolithography step is performedusing extreme ultraviolet light with extremely short wavelength ofseveral nanometers to several tens of nanometers. In light exposureusing extreme ultraviolet, resolution is high and depth of focus islarge. Therefore, the channel length L1 of the thin film transistor 440formed later can be 10 nm to 1000 nm inclusive, operation speed of thecircuit can be increased, and power consumption can be reduced becausean off-current value is extremely small.

Next, the gate insulating layer 444 is formed over the fourth insulatinglayer 446, the oxide semiconductor layers 442 and 472, the first sourceelectrode layer 445 a, the second source electrode layer 448 a, thefirst drain electrode layer 445 b, and the second drain electrode layer448 b.

The gate insulating layer 444 can be formed to have a single-layerstructure or a stacked-layer structure of a silicon oxide layer, asilicon nitride layer, a silicon oxynitride layer, a silicon nitrideoxide layer, or an aluminum oxide layer by a plasma CVD method, asputtering method, or the like. Note that the gate insulating layer 444is preferably formed by a sputtering method so that the gate insulatinglayer 444 does not contain a large amount of hydrogen. In the case wherea silicon oxide film is formed by a sputtering method, a silicon targetor a quartz target is used as a target, and an oxygen gas or a mixed gasof oxygen and argon is used as a sputtering gas.

The gate insulating layer 444 can have a structure in which a siliconoxide layer and a silicon nitride layer are stacked in this order fromthe side of the second source electrode layer 448 a and the second drainelectrode layer 448 b. For example, a silicon oxide layer (SiO_(x)(x>0)) with a thickness of 5 nm to 300 nm inclusive is formed as thefirst gate insulating layer, a silicon nitride layer (SiO_(y) (y>0))with a thickness of 50 nm to 200 nm inclusive is stacked as the secondgate insulating layer over the first gate insulating layer by asputtering method, to form a gate insulating layer with a thickness of100 nm. In this embodiment, a silicon oxide layer with a thickness of100 nm is formed by an RF sputtering method in an atmosphere containingoxygen and argon (the flow rate of oxygen is 25 sccm, and the flow rateof argon is 25 sccm), under conditions where the pressure is 0.4 Pa, anda high-frequency power source is 1.5 kW.

Next, a resist mask is formed by a sixth photolithography step,selective etching is performed so as to remove part of the gateinsulating layer 444 and the fourth insulating layer 446, and an openingis formed to reach the source electrode layer or the drain electrodelayer of the thin film transistor 470.

Then, a conductive film is formed over the gate insulating layer 444 andthe opening, and gate electrode layers 441 and 471 and wiring layers 474a and 474 b are formed by a seventh photolithography step. Note that aresist mask may be formed by an inkjet method. Formation of the resistmask by an inkjet method needs no photomask; thus, manufacturing costcan be reduced.

The gate electrode layers 441 and 471 and the wiring layers 474 a and474 b can be formed to have a single-layer or stacked-layer structureusing a metal material such as molybdenum, titanium, chromium, tantalum,tungsten, aluminum, copper, neodymium, or scandium, or an alloy materialwhich contains any of these materials as its main component.

For example, as a two-layer structure of the gate electrode layers 441and 471 and the wiring layers 474 a and 474 b, the following structuresare preferable: a two-layer structure of an aluminum layer and amolybdenum layer stacked thereover, a two-layer structure of a copperlayer and a molybdenum layer stacked thereover, a two-layer structure ofa copper layer and a titanium nitride layer or a tantalum nitride layerstacked thereover, and a two-layer structure of a titanium nitride layerand a molybdenum layer. As a three-layer structure, a stack of atungsten layer or a tungsten nitride layer, a layer of an alloy ofaluminum and silicon or an alloy of aluminum and titanium, and atitanium nitride layer or a titanium layer is preferable. Note that agate electrode layer can be formed using a conductive film having alight-transmitting property. As an example of a conductive film having alight-transmitting property, a transparent conductive oxide or the likecan be given.

In this embodiment, a tungsten film with a thickness of 150 nm is formedas the gate insulating layers 441 and 471 and the wiring layers 474 aand 474 b.

Next, a second heat treatment (preferably at a temperature of 200° C. to400° C. inclusive, for example, 250° C. to 300° C. inclusive) isperformed in an inert gas atmosphere or an oxygen gas atmosphere. Inthis embodiment, the second heat treatment is performed at 250° C. in anitrogen atmosphere for one hour. The second heat treatment may beperformed after a protective insulating layer or a planarizinginsulating layer is formed over the thin film transistors 440 and 470.

Further, heat treatment may be performed at 100° C. to 200° C. inclusivefor one hour to 30 hours inclusive in an air atmosphere. This heattreatment may be performed at a fixed heating temperature.Alternatively, the following change in the heating temperature may beconducted plural times repeatedly: the heating temperature is increasedfrom a room temperature to a temperature of 100° C. to 200° C. inclusiveand then decreased to a room temperature. Further, this heat treatmentmay be performed before formation of the insulating layer under areduced pressure. Under the reduced pressure, the heat treatment timecan be shortened.

Through the above steps, the thin film transistors 440 and 470respectively including the oxide semiconductor layers 442 and 472 with areduced concentration of hydrogen, moisture, hydride, and hydroxide canbe formed (see FIG. 1B).

The thin film transistor 470 in which parasitic capacitance between theelectrode layer 479 c and a fourth drain electrode layer 478 b isreduced by the fifth insulating layer 473 includes a third sourceelectrode layer 475 a, a fourth source electrode layer 478 a, a thirddrain electrode layer 475 b, and the fourth drain electrode layer 478 b.Note that the electrode layer 479 c overlapping with the fifthinsulating layer 473 is a gate signal line, and describes a structure ofa wiring intersection with the fourth drain electrode layer 478 b. Thethird source electrode layer 475 a is electrically connected to theelectrode layer 479 a. The fourth source electrode layer 478 a iselectrically connected to a wiring layer 474 a. The thin film transistor470 is a thin film transistor which has a channel length L2 longer thanthe channel length L1 of the thin film transistor 440 and a smalloff-current value.

In addition, a protective insulating layer or a planarizing insulatinglayer for planarization may be formed over the thin film transistors 440and 470. For example, a protective insulating layer can be formed tohave a single-layer or stacked-layer structure of a silicon oxide layer,a silicon nitride layer, a silicon oxynitride layer, a silicon nitrideoxide layer, or an aluminum oxide layer.

The planarizing insulating layer can be formed using an organic materialhaving heat resistance, such as polyimide, acrylic, benzocyclobutene,polyamide, or epoxy. Other than such organic materials, it is alsopossible to use a low-dielectric constant material (a low-k material), asiloxane-based resin, PSG (phosphosilicate glass), BPSG(borophosphosilicate glass), or the like. The planarizing insulatinglayer may be formed by stacking a plurality of insulating films formedusing these materials.

Note that the siloxane-based resin corresponds to a resin including aSi—O—Si bond formed using a siloxane-based material as a startingmaterial. The siloxane-based resin may include as a substituent anorganic group (e.g., an alkyl group or an aryl group) or a fluoro group.In addition, the organic group may include a fluoro group.

There is no particular limitation on the method for forming theplanarizing insulating layer. The planarizing insulating layer can beformed, depending on the material, by a method such as a sputteringmethod, an SOG method, a spin coating method, a dipping method, a spraycoating method, or a droplet discharge method (e.g., an inkjet method,screen printing, or offset printing), or a tool such as a doctor knife,a roll coater, a curtain coater, or a knife coater, or the like.

The electrode layer 479 b provided below the oxide semiconductor layer472 of the thin film transistor 470 can function as a back gate. Apotential of the back gate can be a fixed potential, e.g., 0V, or aground potential, and may be determined as appropriate by apractitioner. In addition, by providing the gate electrodes above andbelow the oxide semiconductor layer, in a bias-temperature stress test(hereinafter, referred to as a BT test) for examining reliability of thethin film transistor, the amount of shift in threshold voltage of thethin film transistor between before and after the BT test can bereduced. That is, provision of the gate electrodes above and below theoxide semiconductor layer can improve the reliability.

Further, by controlling gate voltage applied to the electrode layer 479b, threshold voltage can be determined. Alternatively, when thethreshold voltage is set positive, the thin film transistor can functionas an enhancement type transistor. Further alternatively, when thethreshold voltage is set negative, the thin film transistor can functionas a depletion type transistor.

For example, an inverter circuit including a combination of theenhancement type transistor and the depletion type transistor(hereinafter, such a circuit is referred to as an EDMOS circuit) can beused for a driver circuit. The driver circuit includes at least a logiccircuit portion, and a switch portion or a buffer portion. The logiccircuit portion has a circuit structure including the above EDMOScircuit. Further, a thin film transistor by which large on-state currentcan flow is preferably used for the switch portion or the bufferportion. A depletion type transistor or a thin film transistor includinggate electrodes above and below an oxide semiconductor layer is used.

Thin film transistors having different structures can be formed over onesubstrate without greatly increasing the number of steps. For example,an EDMOS circuit using the thin film transistor including gateelectrodes above and below the oxide semiconductor layer may be formedin an integrated circuit for high-speed driving, and a thin filmtransistor including a gate electrode above an oxide semiconductor layercan be formed in other regions.

Note that an n-channel TFT whose threshold voltage is positive isreferred to as an enhancement type transistor, and an n-channel TFTwhose threshold voltage is negative is referred to as a depletion typetransistor, throughout this specification.

In the thin film transistor 470 and the thin film transistor 440, when asilicon nitride film is used for both the gate insulating layer 444 andthe first insulating layer 447 a, the oxide semiconductor layers 442 and472 can be sandwiched between silicon nitride films, and the entry ofhydrogen or moisture can be effectively blocked. With such a structure,the concentration of water or hydrogen included in the oxidesemiconductor layers 442 and 472 can be reduced to the utmost, andreentry of water or hydrogen can be prevented.

Embodiment 2

In Embodiment 1, the thin film transistor 470 including a wiringintersection and the thin film transistor 440 including the gateelectrode layer 441 only above the oxide semiconductor layer 442 isdescribed. Hereinafter, an example of forming an inverter circuit of anintegrated circuit using two n-channel thin film transistors will bedescribed. Note that since the manufacturing process of the thin filmtransistor is almost the same as that in Embodiment 1, only differentpoints are described in detail.

An integrated circuit is formed using an inverter circuit, a capacitor,a resistor, and the like; therefore, a process of forming a capacitorand two kinds of resistors over one substrate in addition to theinverter circuit is also described.

When the inverter circuit is formed using two n-channel TFTs incombination, there are two kinds of inverter circuits: an invertercircuit having a combination of an enhancement type transistor and adepletion type transistor (referred to as an EDMOS circuit) and aninverter circuit having a combination of two enhancement type TFTs(hereinafter, referred to as an EEMOS circuit).

In this embodiment, an example of an EDMOS circuit is described.Further, an equivalent circuit of the EDMOS circuit is illustrated inFIG. 2. A cross-sectional structure of the inverter circuit isillustrated in FIG. 3.

The circuit connection illustrated in FIG. 3 corresponds to thatillustrated in FIG. 2. An example in which the first thin filmtransistor 480 is an enhancement type n-channel transistor and thesecond thin film transistor 490 is a depletion type n-channel transistoris illustrated.

In FIG. 3, electrode layers 479 d, 479 e, 479 f, 479 g, and 479 h areprovided over a substrate 430. The electrode layers 479 d, 479 e, 479 f,479 g, and 479 h can be formed by the same step and using the samematerial as the electrode layers 479 a, 479 b, and 479 c in Embodiment1.

A voltage is applied to the electrode layer 479 d and the thin filmtransistor 480 functions as an enhancement type transistor whosethreshold voltage is set positive. A voltage is also applied to theelectrode layer 479 e and the thin film transistor 490 functions as adepletion type transistor whose threshold voltage is set negative.

The electrode layer 479 f is one electrode which forms the capacitor.The electrode layer 479 g is one electrode connected to a firstresistor. The electrode layer 479 h is one electrode connected to asecond resistor.

A first insulating layer 487 a and a third insulating layer 487 b areformed so as to cover the electrode layers 479 d, 479 e, 479 f, 479 g,and 479 h. Note that although not illustrated, in a region whereparasitic capacitance is to be reduced, a second insulating layerserving as a spacer insulating layer is provided as described inEmbodiment 1. In the capacitor portion, the first insulating layer 487 aoverlapping with the electrode layer 479 f and the third insulatinglayer 487 b overlapping with the electrode layer 479 f each become adielectric.

In this embodiment, unlike in Embodiment 1, the second oxidesemiconductor layer 482 b has a thickness larger than that of the firstoxide semiconductor layer 482 a. Deposition and patterning are eachperformed twice to make the second oxide semiconductor layer 482 bthick. With such a large thickness, the thin film transistor 490 canfunction as a depletion type transistor. Since a voltage by which thethreshold voltage is set negative need not necessarily be applied to theelectrode layer 479 e, the electrode layer 479 e can be omitted.

A third oxide semiconductor layer 432 b formed to have the samethickness as that of the first oxide semiconductor layer 482 a functionsas a first resistor. An opening is formed in the first insulating layer487 a and the third insulating layer 487 b which overlap with theelectrode layer 479 h, and the third oxide semiconductor layer 432 b andthe electrode layer 479 h are electrically connected to each otherthrough the opening. A fourth oxide semiconductor layer 432 a formed tohave the same thickness as that of the second oxide semiconductor layer482 b functions as a second resistor, whose resistance value isdifferent from that of the first resistor. An opening is formed in thefirst insulating layer 487 a and the third insulating layer 487 b whichoverlap with the electrode layer 479 g, and the fourth oxidesemiconductor layer 432 a and the electrode layer 479 g are electricallyconnected to each other through the opening.

The thin film transistor 480 includes a first gate electrode layer 481and the oxide semiconductor layer 482 a overlapping with the first gateelectrode layer 481 with a gate insulating layer 492 interposedtherebetween. A first source electrode layer 485 b which is in contactwith part of the oxide semiconductor layer 482 a electrically connectsto a first wiring 484 b. The first wiring 484 b is a power supply lineto which a negative voltage VDL is applied (a negative power supplyline). This power supply line may be a power supply line with a groundpotential (a ground potential power supply line).

The first source electrode layer 485 b is formed using the same materialas that of the first source electrode layer 445 a in Embodiment 1, andthe second source electrode layer 488 b which is formed over and incontact with the first source electrode layer 485 b is formed using thesame material as that of the second source electrode layer 448 a inEmbodiment 1. In Embodiment 1, an example in which the insulating layeris formed and then patterned using the same mask as that of theinsulating film is described; however, in this embodiment, theinsulating film is formed in a step after the conductive layer ispatterned. Subsequently, the insulating film is selectively removed toform an insulating layer 486, the conductive layer is selectively etchedusing the insulating layer 486 as a mask, and the first source electrodelayer 485 b, the second source electrode layer 488 b, a first drainelectrode layer 485 a, and a second drain electrode layer 488 a areformed. The insulating layer 486 is provided to reduce parasiticcapacitance between a second gate electrode layer 491 and a fourth drainelectrode layer 498 b which are formed later.

In the capacitor portion, a first capacitor electrode layer 433 isformed in the same step and using the same material as the first sourceelectrode layer 485 b, and a second capacitor electrode layer 434 isformed in the same step and using the same material as the second sourceelectrode layer 488 b. The first capacitor electrode layer 433 and thesecond capacitor electrode layer 434 overlap with the electrode layer479 f.

A first electrode layer 477 is formed over and in contact with the thirdoxide semiconductor layer 432 b which is the first resistor, in the samestep and using the same material as the first source electrode layer 485b. A second electrode layer 438 is formed over the first electrode layer477 in the same step and using the same material as the second sourceelectrode layer 488 b.

The second thin film transistor 490 includes the second gate electrodelayer 491 functioning as a second wiring and the second oxidesemiconductor layer 482 b which overlaps with the second gate electrodelayer 491 with the gate insulating layer 492 interposed therebetween. Athird wiring 484 a is a power supply line (a positive power supply line)to which a positive voltage VDH is applied.

The second thin film transistor 490 further includes a third sourceelectrode layer 495 a which is partly in contact with and overlappedwith the second oxide semiconductor layer 482 b and a fourth sourceelectrode layer 498 a. The second thin film transistor 490 includes athird drain electrode layer 495 b which is partly in contact with andoverlapped with the second oxide semiconductor layer 482 b and thefourth drain electrode layer 498 b. Note that the third source electrodelayer 495 a and the third drain electrode layer 495 b are formed in thesame step and using the same material as the first source electrodelayer 485 b. The fourth source electrode layer 498 a and the fourthdrain electrode layer 498 b are formed in the same step and using thesame material as the second source electrode layer 488 b.

An opening is formed in the insulating layer 486 to reach the seconddrain electrode layer 488 a. The second drain electrode layer 488 aelectrically connects to the second gate electrode layer 491 functioningas a second wiring, whereby the first thin film transistor 480 and thesecond thin film transistor 490 are connected to form an EDMOS circuit.

A fourth wiring 431 which connects to the second capacitor electrodelayer 434 through an opening in the gate insulating layer 492 in aregion overlapping with the electrode layer 479 f, functions as acapacitor wiring.

A fifth wiring 435 is in contact with the fourth oxide semiconductorlayer 432 a which functions as the second resistor, through an openingin the gate insulating layer 492 in a region overlapping with theelectrode layer 479 g.

In this embodiment, an example in which an EDMOS circuit, a capacitorportion, a first resistor, and a second resistor are formed over onesubstrate is described; however, the thin film transistor in Embodiment1 can also be formed over the same substrate, without particularlimitation.

In this embodiment, a cross-sectional structure of a terminal portion ofa wiring which can be formed over the same substrate is illustrated inFIGS. 4A and 4B. FIG. 4A is a cross-sectional view taken along lineC1-C2 of FIG. 4B.

In FIG. 4A, a conductive layer 437 formed over a stack of the insulatinglayer 486 and the gate insulating layer 492 is a terminal electrode forconnection which functions as an input terminal. In FIG. 4A, anelectrode layer 479 i which is formed of the same material as that ofthe electrode layers 479 d, 479 e, 479 f, 479 g, and 479 h is providedbelow and overlaps with a first terminal electrode layer 439 which iselectrically connected to the first source electrode layer 485 b, withthe first insulating layer 487 a and the third insulating layer 487 binterposed therebetween. The electrode layer 479 i is not electricallyconnected to the first terminal electrode layer 439, and a capacitor asa countermeasure against noise or static electricity can be formed bysetting the potential of the electrode layer 479 i so as to be differentfrom that of the first terminal electrode layer 439, for example,floating, GND, 0 V, or the like. The first terminal electrode layer 439,over which a second terminal electrode layer 489 is provided, iselectrically connected to the conductive layer 437 with the insulatinglayer 486 and the gate insulating layer 492 interposed therebetween.

The first terminal electrode layer 439 can be formed using the samematerial and in the same step as the first source electrode layer 485 b.The second terminal electrode layer 489 can be formed using the samematerial and in the same step as the second source electrode layer 488b. The conductive layer 437 can be formed using the same material and inthe same step as the first gate electrode layer 481.

This embodiment can be freely combined with Embodiment 1.

Embodiment 3

In this embodiment, an example of manufacturing a CPU (centralprocessing unit) using the EDMOS circuit described in Embodiment 2 willbe described.

An example of a block diagram of a CPU is illustrated in FIG. 5. A CPU1001 illustrated in FIG. 5 includes a timing control circuit 1002, aninstruction decoder 1003, a register array 1004, an address logic andbuffer circuit 1005, a data bus interface 1006, an ALU 1007, aninstruction register 1008, and the like.

These circuits are manufactured using the thin film transistor, theinverter circuit, the resistor, the capacitor, and the like described inEmbodiment 1 or Embodiment 2. The thin film transistors described inEmbodiment 1 or Embodiment 2 each use an oxide semiconductor layer withsufficiently reduced hydrogen concentration, whereby the off-current ofthe thin film transistor can be extremely small. By using a thin filmtransistor including an oxide semiconductor layer with sufficientlyreduced hydrogen concentration for at least part of the CPU 1001, powerconsumption can be reduced.

Now, each circuit will be briefly described. The timing control circuit1002 receives an instruction from the external, converts the instructioninto information for the internal, and sends the information to otherblocks. In addition, the timing control circuit gives directions such asreading and writing of memory data to the external, according tointernal operation. The instruction decoder 1003 serves to convertinstruction from the external into information for the internal. Theregister array 1004 is a volatile memory for temporarily storing data.The address logic and buffer circuit 1005 is a circuit for specifyingthe address of an external memory. The data bus interface 1006 is acircuit for taking data in and out of an external memory or a devicesuch as a printer. The ALU 1007 is a circuit for performing anoperation. The instruction register 1008 is a circuit for temporarilystoring an instruction. The CPU includes combination of such circuits.

By using any of the thin film transistors described in Embodiments 1 and2 for at least part of the CPU 1001, leakage current in a standby periodis reduced; thus, power consumption of the driver circuit or the likeused in electronic devices can be reduced.

This embodiment can be freely combined with any of Embodiments 1 and 2.

Embodiment 4

In this embodiment, an example of a usage mode of the semiconductordevice described in the above embodiments will be described.Specifically, an application example of a semiconductor device that caninput and output data without contact is described below with referenceto drawings. The semiconductor device capable of wirelessly transmittingand receiving data is also called an RFID tag, an ID tag, an IC tag, anRF tag, a wireless tag, an electronic tag, or a wireless chip dependingon the application.

One example of a top structure of a semiconductor device described inthis embodiment is described with reference to FIG. 8A. Thesemiconductor device illustrated in FIG. 8A includes a semiconductorintegrated circuit chip 400 having an antenna (also referred to as anon-chip antenna) and a supporting substrate 406 having an antenna 405(also referred to as a booster antenna). The semiconductor integratedcircuit chip 400 is provided over an insulating layer 410 (FIG. 8C) thatis formed over the supporting substrate 406 and the antenna 405. Thesemiconductor integrated circuit chip 400 can be fixed to the supportingsubstrate 406 and the antenna 405 by using the insulating layer 410.

Note that a conductive shield is provided on a surface of thesemiconductor integrated circuit chip 400 to prevent electrostaticbreakdown of the semiconductor integrated circuit (e.g., malfunction ofthe circuit and damage to a semiconductor element) due to electrostaticdischarge. When the conductive shield has high resistance and currentcannot pass through the pattern of the antenna 405, the antenna 405 andthe conductive shield provided on the surface of the semiconductorintegrated circuit chip 400 may be provided in contact with each other.

As for a semiconductor integrated circuit provided in the semiconductorintegrated circuit chip 400, elements such as a plurality of thin filmtransistors for constituting a memory portion or a logic portion areprovided. As a thin film transistor for constituting a memory portion ora logic portion, a thin film transistor using a highly purified oxidesemiconductor layer with sufficiently reduced hydrogen concentration isused. As a semiconductor element in a semiconductor device according tothis embodiment, not only a field-effect transistor but also a memoryelement which uses a semiconductor layer can be employed; accordingly, asemiconductor device which can meet functions required for variousapplications can be manufactured and provided.

FIG. 7A is an enlarged view of the antenna and the semiconductorintegrated circuit that are included in the semiconductor integratedcircuit chip 400 illustrated in FIG. 8A. In FIG. 7A, the antenna 101 isa rectangular loop antenna in which the number of windings is 1;however, an embodiment of the present invention is not limited to thisstructure. The shape of the loop antenna is not limited to a rectangleand may be a shape with curve, for example, a circle. In addition, thenumber of windings is not limited to 1 and may be plural. However, whenthe number of windings of the antenna 101 is 1, parasitic capacitancegenerated between the semiconductor integrated circuit 100 and theantenna 101 can be reduced.

In FIG. 8A and FIG. 7A, the antenna 101 is arranged so as to surroundthe periphery of the semiconductor integrated circuit 100, and theantenna 101 is arranged in a region different from a region of thesemiconductor integrated circuit 100, except portions corresponding topower feeding points 408 indicated by a dashed line. However, thisembodiment is not limited to this structure. As illustrated in FIG. 7B,the antenna 101 may be arranged so as to at least partly overlap withthe semiconductor integrated circuit 100 in addition to the portionscorresponding to the power feeding points 408 indicated by the dashedline. Note that in the case where the antenna 101 is arranged in aregion different from a region of the semiconductor circuit 100 asillustrated in FIG. 8A and FIG. 7A, parasitic capacitance generatedbetween the semiconductor integrated circuit 100 and the antenna 101 canbe reduced.

In FIG. 8A, the antenna 405 can transmit and receive signals or supplypower to/from the antenna 101 by electromagnetic induction mainly in aloop-like shaped portion surrounded by a dashed line 407. In addition,the antenna 405 can send and receive a signal to/from an interrogator orsupply power by using a radio wave mainly in a region other than aportion surrounded by the dashed line 407. A radio wave used as acarrier (a carrier wave) between the interrogator and the semiconductordevice preferably has a frequency of about 30 MHz to 5 GHz, and forexample, may have a frequency band of 950 MHz or 2.45 GHz.

The antenna 405 is a rectangular loop antenna in which the number ofwindings is 1 in the portion surrounded by the dashed line 407; however,an embodiment of the present invention is not limited to this structure.The shape of the loop antenna is not limited to a rectangle and may be ashape with curve, for example, a circle. In addition, the number ofwindings is not limited to 1 and may be plural.

For the semiconductor device described in this embodiment, anelectromagnetic induction method, an electromagnetic coupling method, ora microwave method can be employed. In the case of a microwave method,the shapes of the antenna 101 and the antenna 405 may be determined asappropriate depending on the wavelength of an electromagnetic wave.

If a microwave method (e.g., UHF band (860 MHz band to 960 MHz band), or2.45 GHz band) is used as the signal transmission method in thesemiconductor device, the length, shape, or the like of the antenna maybe determined as appropriate in consideration of the wavelength of anelectromagnetic wave used for signal transmission. For example, each ofthe antennas can be formed into a linear shape (e.g., a dipole antenna)or a flat shape (e.g., a patch antenna or an antenna having a ribbonshape). Further, each of the antennas is not limited to a linear shapeand may have a curved shape, a serpentine curved shape, or in a shapecombining them in consideration of the wavelength of the electromagneticwave.

An example in which the antenna 101 and the antenna 405 have coil shapesand an electromagnetic induction method or an electromagnetic couplingmethod is used is illustrated in FIG. 9.

In FIG. 9, the semiconductor integrated circuit chip 400 having thecoiled antenna 101 is formed over the supporting substrate 406 providedwith the coiled antenna 405 as a booster antenna. Note that thesupporting substrate 406 is sandwiched between the antenna 405 which isa booster antenna, and a capacitor is formed.

Next, the structures and arrangements of the semiconductor integratedcircuit chip 400 and the booster antenna will be described. FIG. 8B is aperspective view of the semiconductor device illustrated in FIG. 8A, inwhich the semiconductor integrated circuit chip 400 and the antenna 405formed over the supporting substrate 406 are stacked. In addition, FIG.8C is a cross-sectional view along a dashed line X-Y of FIG. 8B.

As the semiconductor integrated circuit chip 400 illustrated in FIG. 8C,any of the semiconductor devices described in Embodiment 1 or Embodiment2 can be used, and here, a chip obtained by cutting the semiconductorintegrated circuit into individual chips is referred to as asemiconductor integrated circuit chip. Note that, although thesemiconductor integrated circuit chip illustrated in FIG. 8C is anexample of using Embodiment 1, this embodiment is not limited to thisstructure and can be applied to another embodiment.

The semiconductor integrated circuit 100 illustrated in FIG. 8C issandwiched between a first insulator 112 and a second insulator 102, andthe side surface is also sealed. In this embodiment, the first insulatorand the second insulator between which a plurality of semiconductorintegrated circuits is sandwiched are attached, and then thesemiconductor integrated circuits are individually divided into stacks.A conductive shield is formed each for the divided stacks, and thesemiconductor integrated circuit chips 400 are formed. There is noparticular limitation on a separation means as long as physicalseparation is possible, and separation is performed by laser beamirradiation in this embodiment.

In FIG. 8C, the semiconductor integrated circuit 100 is closer to theantenna 405 than the antenna 101; however an embodiment of the presentinvention is not limited to this structure. The antenna 101 may becloser to the antenna 405 than the semiconductor integrated circuit 100.The semiconductor integrated circuit 100 and the antenna 101 may bedirectly attached to the first insulator 112 and the second insulator102, or may be attached by a bonding layer functioning as an adhesive.

Next, operation of the semiconductor device of this embodiment will bedescribed. FIG. 6 is a block diagram illustrating an example of astructure of a semiconductor device of this embodiment. A semiconductordevice 420 illustrated in FIG. 6 includes an antenna 422 as a boosterantenna, a semiconductor integrated circuit 423, and an antenna 424 asan on-chip antenna. When an electromagnetic wave is transmitted from aninterrogator 421, the antenna 422 receives the electromagnetic wave togenerate alternate current, whereby a magnetic field is generated aroundthe antenna 422. Then, a loop portion of the antenna 422 iselectromagnetically coupled to the loop antenna 424, so that inducedelectromotive force is generated in the antenna 424. The semiconductorintegrated circuit 423 receives a signal or power from the interrogator421 by using the induced electromotive force. On the other hand, currentflows into the antenna 424 and induced electromotive force is generatedin the antenna 422 in accordance with a signal generated in thesemiconductor integrated circuit 423, whereby a signal can be sent tothe interrogator 421 using a reflected wave of the radio wave that issent from the interrogator 421.

Note that the antenna 422 can be divided between the loop portion thatis mainly electromagnetically coupled to the antenna 424 and a portionthat mainly receives electromagnetic waves from the interrogator 421.The shape of the antenna 422 in the portion in which an electric wavefrom the interrogator 421 is mainly received may be a shape in which anelectric wave can be received. For example, the shape of a dipoleantenna, a folded dipole antenna, a slot antenna, a meander lineantenna, a microstrip antenna, or the like may be used.

Although FIGS. 8A to 8C illustrate the structure of the semiconductorintegrated circuit having only one antenna, this embodiment of thedisclosed invention is not limited to this structure. A semiconductordevice may include two antennas, that is, an antenna for receiving powerand an antenna for receiving a signal. With the two antennas, frequencyof a radio wave for supplying power and frequency of a radio wave fortransmitting a signal can be separately used.

In a semiconductor device of this embodiment, the on-chip antenna isused and a signal or power can be sent and received between the boosterantenna and the on-chip antenna without contact; therefore, unlike thecase where a semiconductor integrated circuit is connected to anexternal antenna, the semiconductor integrated circuit and the antennaare less likely to be disconnected due to external force, and generationof initial failure in the connection can also be suppressed. Inaddition, the booster antenna is used in this embodiment. Accordingly,unlike the case where only the on-chip antenna is used, the advantage ofan external antenna can also be offered: that is, the area of thesemiconductor integrated circuit does not significantly limit the sizeor shape of the on-chip antenna, the frequency band of radio wavescapable of being received is not restricted, and the communicationdistance can be increased.

The semiconductor integrated circuit can be directly formed over aflexible substrate. Alternatively, the semiconductor integrated circuitmay be transferred from a formation substrate (for example, a glasssubstrate) to another substrate (for example, a plastic substrate).

There is no particular limitation on the method of transferring thesemiconductor integrated circuit from the formation substrate to anothersubstrate, and a variety of methods can be used. For example, aseparation layer may be formed between the formation substrate and thesemiconductor integrated circuit.

For example, in the case where a metal oxide film is formed as theseparation layer, the metal oxide film is weakened by crystallization,and an element layer including the semiconductor integrated circuit,which is a layer to be separated, can be separated from the formationsubstrate. After the metal oxide film is weakened by crystallization,part of the separation layer may be removed by etching with use of ahalogen fluoride gas such as NF₃, BrF₃, or ClF₃, and then separation maybe performed in the weakened metal oxide film.

In addition, when a substrate having a light-transmitting property isused as the formation substrate and a film containing nitrogen, oxygen,hydrogen or the like (e.g., an amorphous silicon film containinghydrogen, an alloy film containing hydrogen, an alloy film containingoxygen or the like) is used as the separation layer, the separationlayer is irradiated with laser light through the formation substrate,and nitrogen, oxygen, or hydrogen contained in the separation layer isevaporated so that separation can occur between the formation substrateand the separation layer.

Alternatively, the layer to be separated may be separated from theformation substrate by removing the separation layer by etching.

Alternatively, a method of removing the formation substrate bymechanical grinding or a method of removing the formation substrate byetching using a halogen fluoride gas such as NF₃, BrF₃, ClF₃ or the likeor HF, or the like can be employed. In this case, the separation layercan be omitted.

Alternatively, laser irradiation, etching using a gas, a solution, orthe like, or a sharp knife or a scalpel, can be used so as to form agroove to expose the separation layer. The groove can trigger separationof the layer to be separated from the formation substrate from theseparation layer.

For example, as a separation method, mechanical force (a separationprocess with a human hand or with a gripper, a separation process byrotation of a roller, or the like) may be used. Alternatively, the layerto be separated may be separated from the separation layer in such amanner that a liquid is dropped into the groove to allow the liquid tobe infiltrated into the interface between the separation layer and thelayer to be separated. Alternatively, a method can be employed in whicha fluoride gas such as NF₃, BrF₃, or ClF₃ is introduced into the groove,and the separation layer is removed by etching with the use of thefluoride gas so that the layer to be separated is separated from theformation substrate. The separation may be performed while pouring aliquid such as water.

As another separation method, if the separation layer is formed usingtungsten, separation can be conducted while the separation layer isbeing etched by a mixed solution of ammonia water and hydrogen peroxidewater.

A thin film transistor using a highly purified oxide semiconductor layerwith sufficiently reduced hydrogen concentration has a smalloff-current, and can realize low power consumption. By the conductiveshield covering the semiconductor integrated circuit, electrostaticbreakdown of the semiconductor integrated circuit (malfunction of thecircuit or damage of the semiconductor element) due to electrostaticdischarge can be prevented. Furthermore, by using the pair of insulatorsholding the semiconductor integrated circuit therebetween, a resistantand highly-reliable semiconductor device having a reduced thickness andsize can be provided.

Embodiment 5

This embodiment will describe examples of the application of asemiconductor device capable of wireless data communication, whichincludes the above-described nonvolatile semiconductor memory deviceformed using the device in Embodiment. 4. According to its mode of use,a semiconductor device capable of inputting and outputting datacontactlessly may also be referred to as an RFID tag, an ID tag, an ICtag, an IC chip, an RF tag, a wireless tag, an electronic tag, or awireless chip.

A semiconductor device 800 has a function of communicating data withoutcontact, and includes a high-frequency circuit 810, a power supplycircuit 820, a reset circuit 830, a clock generating circuit 840, a datademodulating circuit 850, a data modulating circuit 860, a controlcircuit 870 which controls another circuit, a memory circuit 880, and anantenna 890 (see FIG. 10A). The high-frequency circuit 810 receives asignal from the antenna 890 and outputs a signal received from the datademodulating circuit 860 through the antenna 890. The power supplycircuit 820 generates a power supply potential from the received signal.The reset circuit 830 generates a reset signal. The clock generatingcircuit 840 generates various clock signals based on the signal inputfrom the antenna 890. The data demodulating circuit 850 demodulates thereceived signal and outputs the signal to the control circuit 870. Thedata modulating circuit 860 modulates a signal received from the controlcircuit 870. Further, as the control circuit 870, a code extractingcircuit 910, a code determining circuit 920, a CRC determining circuit930, and an output unit circuit 940 are provided, for example. Thecontrol circuit 870 includes, for example, a code extracting circuit910, a code determining circuit 920, a CRC determining circuit 930, andan output unit circuit 940. The code determining circuit 920 comparesthe extracted code with a reference code to determine the content of theinstruction. The CRC determining circuit 930 detects a transmissionerror and the like based on the determined code.

Next, an example of an operation of the above-mentioned semiconductordevice will be described. First, a radio signal is received by theantenna 890. The radio signal is transmitted to the power supply circuit820 via the high frequency circuit 810, thereby generating a high powersupply potential (hereinafter referred to as a VDD). The VDD is suppliedto each circuit of the semiconductor device 800. A signal transmitted tothe data demodulating circuit 850 via the high frequency circuit 810 isdemodulated (hereinafter referred to as a demodulated signal). Further,a signal and a demodulated signal passing through the reset circuit 830and the clock generating circuit 840 via the high frequency circuit 810are transmitted to the control circuit 870. The signals transmitted tothe control circuit 870 are analyzed by the code extracting circuit 910,the code determining circuit 920, the CRC determining circuit 930, andthe like. Then, based on the analyzed signals, information in thesemiconductor device stored in the memory circuit 880 is output. Theoutput data of the semiconductor device 800 is encoded via the outputunit circuit 940. In addition, the encoded data of the semiconductordevice 800 passes through the data modulating circuit 860 to betransmitted as a radio signal via the antenna 890. Note that a low powersupply potential (hereinafter referred to as VSS) is common in theplurality of circuits included in the semiconductor device 800, and GNDcan be used as VSS.

In this manner, the data of the semiconductor device 800 can be read bytransmitting a signal from a communication device to the semiconductordevice 800 and receiving a signal from the semiconductor device 800 bythe communication device.

Moreover, in the semiconductor device 800, power supply voltage may besupplied to each circuit by electromagnetic waves without mounting apower source (battery), or a power source (battery) may be mounted sothat power supply voltage is supplied to each circuit by bothelectromagnetic waves and the power source (battery).

Next, an example of a mode of use of a semiconductor device capable ofinputting and outputting data contactlessly will be described. Acommunication device 3200 is provided for a side surface of a mobileterminal which includes a display portion 3210. A semiconductor device3230 is provided for a side surface of an article 3220 (FIG. 10B). Whenthe communication device 3200 is put close to the semiconductor device3230 on the article 3220, information on the article 3220, such as theraw material or the source of the product, inspection result in eachproduction step, history of the distribution process, and explanation ofthe article is displayed on the display portion 3210. When a product3260 is transferred by a conveyer belt, the product 3260 can beinspected using a communication device 3240 and a semiconductor device3250 provided on the product 3260 (FIG. 10C). When the semiconductordevice is used in a system in this manner, information can be obtainedeasily, and higher performance and higher added value are achieved.

As described above, a semiconductor device of the present invention,which has a very wide range of application, can be used in electronicdevices in all kinds of fields.

Embodiment 6

The thin film transistors obtained in Embodiment 1 or Embodiment 2 arethin film transistors each using a highly purified oxide semiconductor.By forming a circuit using the thin film transistors, low powerconsumption can be realized and operation of a memory circuit can bestabilized.

In this embodiment, an example of a memory circuit which can be formedusing the thin film transistor in Embodiment 1 is described.

FIG. 11A illustrates an equivalent circuit diagram of an example of amemory circuit. The memory circuit illustrated in FIG. 11A includes arow decoder, a writing circuit and a refresh circuit, a column decoder,and memory elements 1100 arranged in matrix. A signal line connected tothe memory elements 1100 arranged in matrix is connected to the rowdecoder through the writing circuit and the refresh circuit, and a scanline connected to the memory elements 1100 arranged in matrix isconnected to the column decoder. A bit signal is input to the rowdecoder. A read enable signal and a write enable signal (RE/WE), a datasignal (data), and an output signal (OUT) are input to the writingcircuit and the refresh circuit.

Each of the memory elements 1100 includes a capacitor element and a thinfilm transistor. One of a source and a drain of the thin film transistoris connected to the signal line, and the other of the source and thedrain of the thin film transistor is connected to one electrode of thecapacitor element, and the other electrode of the capacitor element isconnected to the low potential side (preferably, a reference potentialVss).

FIG. 11B illustrates a specific structural example of the refreshcircuit provided in the writing circuit and the refresh circuitillustrated in FIG. 11A.

The writing circuit and the refresh circuit illustrated in FIG. 11Binclude an AND circuit and a sense amplifier. To one input of each of afirst AND circuit 1101, a second AND circuit 1102, and a third ANDcircuit 1103, a signal is input from the row decoder. A PRC signal isinput to the other input of the first AND circuit 1101, the write enablesignal (WE) is input to the other input of the second AND circuit 1102,and the read enable signal (RE) is input to the other input of the thirdAND circuit 1103. The output of the first AND circuit 1101 controlson/off of a first switch 1104, the output of the second AND circuit 1102controls on/off of a second switch 1105, and the output of the third ANDcircuit 1103 controls on/off of a third switch 1106. A pre-charge signalline Vprc is connected to the signal line through the first switch 1104,and a data signal line data is connected to the signal line through thesecond switch 1105.

The signal line connected though the first switch 1104 and the secondswitch 1105 are connected to the sense amplifier through the thirdswitch 1106. A signal is output to the output signal line (OUT) from thesense amplifier.

Note that the above AND circuit may have a general structure, andpreferably has a simple structure.

A sense amplifier is a circuit having a function of amplifying inputsignals.

Note that as a signal here, an analog signal or a digital signal whichuses voltage, current, resistance, frequency, or the like can be used,for example. For example, at least two potentials, that is, a firstpotential and a second potential are set, a high-level (also referred toas high potential or V_(H)) potential is used as the first potential,and a low-level (also referred to as low potential or V_(L)) potentialis used as the second potential, whereby a binary digital signal can beset. Although V_(H) and V_(L) are preferably constant values, V_(H) andV_(L) may take a wide range of values, in consideration of influence ofnoise.

Note that here, terms with ordinal numbers, such as “first” and“second”, are used in order to avoid confusion among components, and theterms do not limit the components numerically.

Thus, a memory circuit can be manufactured using the thin filmtransistor described in Embodiment 1 and the capacitor described inEmbodiment 2.

A refresh timing of the memory circuit is determined to a certain timeinterval in the design phase, based on the leakage current of the memoryelements 1100 which is evaluated in advance. That is, the refresh timingis set in consideration of the temperature dependence of leakage currentand fluctuation of the manufacturing process, after the chip iscompleted.

In the thin film transistors described in Embodiment 1 or Embodiment 2,an oxide semiconductor layer with sufficiently reduced hydrogenconcentration is used, whereby the off-current of the thin filmtransistors can be made extremely small. Further, since temperaturecharacteristics of the off-current hardly change within the temperatureof from −30° C. to 120° C., the extremely small value can be kept.

Therefore, when the thin film transistors described in Embodiment 1 orEmbodiment 2 are used, refresh interval can be set long compared to atransistor using silicon, and power consumption in a standby period canbe reduced.

In addition, since the off-current has little temperature dependence,the memory circuit in this embodiment is suitable for an in-vehicleelectronic device. Since leakage current in a standby period isextremely small, when used for electric vehicles, traveling distance pera certain amount of charging hardly changes even when the standby periodis long.

The thin film transistors described in Embodiment 1 or Embodiment 2 eachuse an oxide semiconductor which is intrinsic or substantiallyintrinsic, in which impurities which may become carrier donors (donorsor acceptors) are reduced to an extremely small number.

FIG. 12 illustrates a band structure between the source and the drain ofthe thin film transistor described in Embodiment 1 or Embodiment 2.Fermi level of the highly purified oxide semiconductor is positioned inthe center of the forbidden band in an ideal state. In an oxidesemiconductor with sufficiently reduced hydrogen concentration, thenumber of minority carriers (holes in this case) is zero or extremelyclose to zero.

When work function is (km and electron affinity of the oxidesemiconductor is x, in the case where work function (km is smaller thanthe electron affinity x, ohmic contact is formed with electrons.

Here, when φm=χ, Fermi level of an electrode metal and the level of theend of the conduction band of the oxide semiconductor correspond to eachother at the bonding surface. When it is assumed that the band gap is3.05 eV, the electronic affinity is 4.3 eV, the state is an intrinsicstate (the carrier concentration is approximately 1×10⁻⁷/cm³), andtitanium (Ti) whose work function is 4.3 eV is used as the sourceelectrode and the drain electrode, barrier is not formed againstelectrons, as illustrated in FIG. 12.

A schematic view of the energy band structure is illustrated in FIG. 13.In a state where positive voltage (V_(D)>0) is applied to the drain, thedashed line illustrates a case where a voltage is not applied to a gate(V_(G)=0), and the solid line illustrates a case where positive voltage(V_(G)>0) is applied to the gate. In the case where a voltage is notapplied to the gate, carriers (electrons) are not injected from theelectrode to the oxide semiconductor side because of high potentialbarrier, and an off state where no current flows is shown. On the otherhand, when positive voltage is applied to the gate, potential barrier isreduced, and an on state where current flows is shown.

Here, height of the barrier has influence on carrier mobility. When thedrain voltage is increased, the height of the barrier (h_(b)) becomessmaller and mobility increases. If the work function (km of the sourceelectrode is approximately the same as the electron affinity of theoxide semiconductor, h_(b) becomes further smaller, and higher mobilitycan be expected. Note that it is necessary that such an electrodematerial and the oxide semiconductor do not come into contact with eachother to form an insulator.

In such a case, in a bottom-gate (inverted stagger) transistor, thebarrier between the source and the drain becomes small, and a parasiticchannel is more likely to be formed. Therefore, a top-gate transistor ispreferably used in the case of increasing mobility.

FIG. 14A is an energy band diagram of a MOS structure when the gatevoltage is set positive, which illustrates the case of a transistorusing an oxide semiconductor. In this case, thermally excited carriershardly exist in a highly purified oxide semiconductor, and carriers arenot accumulated in the vicinity of the gate insulating film even whenpositive gate voltage is applied. However, carriers injected from thesource side can be propagated as illustrated in FIG. 13.

FIG. 14B is an energy band diagram of a MOS structure when the gatevoltage is set negative, which illustrates the case of a transistorusing an oxide semiconductor. Since the oxide semiconductor has almostno minority carriers (holes), carriers are not accumulated in thevicinity of the gate insulating film. This means that the off-current issmall.

Note that a band diagram of a transistor in the case of using a siliconsemiconductor is illustrated in FIG. 15. The intrinsic carrier densityof the silicon semiconductor is approximately 1.45×10¹⁰/cm³ (300 K), andcarriers exist even at room temperature. In practical use, a siliconwafer to which an impurity element such as phosphorus or boron is addedis used; therefore, the silicon semiconductor actually has 1×10¹⁴/cm³ ormore carriers which contribute to conduction between the source and thedrain. Further, since the band gap of the silicon semiconductor is 1.12eV, the off-current of a transistor using a silicon semiconductorgreatly fluctuates depending on temperature.

As described above, carriers which are thermally excited at a practicaloperation temperature can be eliminated so that a transistor can operateonly by the carriers injected from the source side; not by simply usingan oxide semiconductor with a wide band gap for the transistor, but byreducing impurities such as hydrogen which form donors as much aspossible so that the carrier concentration is lower than or equal to1×10¹⁴/cm³, preferably lower than or equal to 1×10¹²/cm³. Accordingly,the off-current is decreased to be less than 1×10⁻¹³A and a transistorwith extremely stable operation, whose off-current hardly changesdepending on temperature, can be obtained.

Embodiment 7

In this embodiment, an example of a shift register which can be formedusing the thin film transistors in Embodiment 1 or Embodiment 2 isdescribed.

FIG. 16A is an equivalent circuit diagram illustrating an example of ashift register. The shift register illustrated in FIG. 16A includes twoclock signal lines and two stages of flip-flops each of which iselectrically connected to either of these clock signal lines. Note thata clock signal line may be further provided, and a larger number ofstages of flip-flops may be provided.

In the two clock signal lines, each clock signal is input as follows:when one clock signal line is switched to high level (V_(H)), the otheris switched to low level (V_(L)).

In the shift register illustrated in FIG. 16A, an example of a shiftregister is illustrated, which includes flip-flops which are in orderfrom a flip-flop in a first stage which is electrically connected to afirst clock signal line CLK and a flip-flop in a second stage which iselectrically connected to the second clock signal line CLKB, to aflip-flop in an (n−1)th stage and a flip-flop in an (n) th stage.However, the present invention is not limited thereto, and the shiftregister having at least a first flip-flop and a second flip-flop isacceptable.

The clock signal line CLK is a wiring to which a clock signal CK isinput.

A clock signal line CLKB is a wiring to which a clock signal CKB isinput.

The clock signal CK and the clock signal CKB can be generated using aNOT circuit (inverter circuit) for example.

A start signal SP and a start signal SPB are input to the firstflip-flop, a clock signal CK is input thereto as a clock signal, and thefirst flip-flop outputs an output signal OUT depending on the state ofthe signal SP, the signal SPB, and the clock signal CK, which are input.Note that in this specification, the state of a signal refers to apotential, a current, or a frequency of the signal, for example.

The start signal SP and the start signal SPB can be generated using aNOT circuit (inverter circuit) for example.

Note that as a signal here, an analog signal or a digital signal whichuses voltage, current, resistance, frequency, or the like can be used,for example. For example, at least two potentials, that is, a firstpotential and a second potential are set, using a high-level (alsoreferred to as high potential or V_(H)) potential as the first potentialand a low-level (also referred to as low potential or V_(L)) potentialas the second potential, whereby a binary digital signal can be set.Although it is preferable that V_(H) and V_(L) be a constant value,V_(H) and V_(L) may take a wide range of values, in consideration ofinfluence of noise.

Note that here, terms with ordinal numbers, such as “first” and“second”, are used in order to avoid confusion among components, and theterms do not limit the components numerically.

The second flip-flop has the following function: the output signal OUTof the first flip-flop is input as a start signal SP, a clock signal CK2is input as the clock signal, and the second flip-flop outputs a signalFF2out as an output signal, which is set depending on the state of theoutput signal FFlout and the clock signal CK2 which are input.

A start signal SP and a start signal SPB are input to the secondflip-flop, a clock signal CK2 is input thereto as a clock signal, andthe second flip-flop outputs an output signal OUTB depending on thestate of the signal SP, the signal SPB, and the clock signal CK2, whichare input.

FIG. 16B illustrates a specific structural example of the firstflip-flop illustrated in FIG. 16A.

The start signal SP is input to one of a source or a drain of a firstthin film transistor 1111 and one of a source or a drain of a fourththin film transistor 1114.

The start signal SPB is input to one of a source or a drain of a secondthin film transistor 1112 and one of a source or a drain of a third thinfilm transistor 1113.

The clock signal CLK is input to each gate of the first thin filmtransistor 1111, the second thin film transistor 1112, the third thinfilm transistor 1113, and the fourth thin film transistor 1114.

The other of the source and the drain of the first thin film transistor1111 is connected to a gate of a fifth thin film transistor 1115 and oneelectrode of a first capacitor element 1119.

The other of the source and the drain of the second thin film transistor1112 is connected to a gate of a sixth thin film transistor 1116 and oneelectrode of a second capacitor element 1120.

The other of the source and the drain of the third thin film transistor1113 is connected to a gate of a seventh thin film transistor 1117 andone electrode of a third capacitor element 1121.

The other of the source and the drain of the fourth thin film transistor1114 is connected to a gate of an eighth thin film transistor 1118 andone electrode of a fourth capacitor element 1122.

A drain of the fifth thin film transistor 1115 is connected to a highpotential side (preferably, a power supply potential Vdd). A source ofthe fifth thin film transistor 1115 is connected to the other electrodeof the first capacitor element 1119 and a drain of the sixth thin filmtransistor 1116, and outputs an output signal OUT. The other electrodeof the second capacitor element 1120 and a source of the sixth thin filmtransistor 1116 are connected to a low potential side (preferably, areference potential Vss).

A drain of the seventh thin film transistor 1117 is connected to a highpotential side (preferably, a power supply potential Vdd). A source ofthe seventh thin film transistor 1117 is connected to the otherelectrode of the third capacitor element 1121 and a drain of the eighththin film transistor 1118, and outputs an output signal OUTB. The otherelectrode of the fourth capacitor element 1122 and a source of theeighth thin film transistor 1118 are connected to a low potential side(preferably, a reference potential Vss).

The first capacitor element 1119, the second capacitor element 1120, thethird capacitor element 1121, and the fourth capacitor element 1122 canbe formed over the same substrate as the thin film transistor, using thecapacitor described in Embodiment 2.

As described above, a flip-flop circuit can be manufactured using thethin film transistor which uses a highly purified oxide semiconductorlayer as described in Embodiment 1 or Embodiment 2 and the capacitordescribed in Embodiment 2.

Embodiment 8

In this embodiment, an example of a boosting circuit (a charge pumpcircuit) which can be formed using the thin film transistor inEmbodiment 1 or Embodiment 2 is described.

FIG. 17 illustrates a specific structural example of a boosting circuit.The boosting circuit illustrated in FIG. 17 includes two clock signallines, a plurality of transistors 1123 that are diode-connected in aforward direction, a plurality of capacitor elements 1124 whose oneelectrode is connected between a source and a drain of the plurality oftransistors, and a storage capacitor element whose one electrode isconnected to the last of the plurality of transistors and the otherelectrode is kept at a constant potential. The other electrode of theplurality of capacitor elements is electrically connected to either ofthe two clock signal lines.

Note that a clock signal line may be further provided.

A transistor and a capacitor element may be further provided inaccordance with the potential desired to be output.

In the two clock signal lines, each clock signal is input as follows:when one clock signal line is switched to high level (V_(H)), the otheris switched to low level (V_(L)).

Each of the clock signal CLK and the clock signal CLKB can be generatedusing a NOT circuit (inverter circuit) for example. A NOT circuit can bemanufactured using the EDMOS circuit described in Embodiment 2.

By using the boosting circuit illustrated in FIG. 17, a potential inputfrom Vin can be raised to Vout. For example, when a power supplypotential Vdd is input from Vin, a potential higher than Vdd can beoutput from Vout and raised to a desired potential. Thus, a signal witha potential raised to a desired potential is input to a power supplyline for example, and is used for each circuit mounted on the samesubstrate as the boosting circuit.

Note that here, a constant potential kept at the other electrode of thestorage capacitor element may be a power supply potential Vdd or areference potential Vss for example.

As a signal here, an analog signal or a digital signal which usesvoltage, current, resistance, frequency, or the like can be used, forexample. For example, at least two potentials, that is, a firstpotential and a second potential are set, a high-level (also referred toas high potential or V_(H)) potential is used as the first potential,and a low-level (also referred to as low potential or V_(L)) potentialis used as the second potential, whereby a binary digital signal can beset. Although it is preferable that V_(H) and V_(L) be a constant value,V_(H) and V_(L) can take a wide range of values, in consideration ofinfluence of noise.

Note that here, terms with ordinal numbers, such as “first” and“second”, are used in order to avoid confusion among components, and theterms do not limit the components numerically.

As described above, a boosting circuit can be manufactured using thethin film transistor described in Embodiment 1 and the capacitordescribed in Embodiment 2.

Embodiment 9

In this embodiment, examples of an electronic device mounted with asemiconductor integrated circuit which can be obtained in any ofEmbodiments 1 to 8 are described with reference to FIGS. 18A to 18E. Byusing the method described in Embodiment 4, that is, a method oftransferring a semiconductor integrated circuit from a formationsubstrate to another substrate, a semiconductor integrated circuit canbe mounted on a plastic film or the like, so that electronic deviceswhich are thinned or made flexible can be manufactured. Note that asemiconductor integrated circuit is mounted on a circuit board or thelike and then incorporated inside the main body of electronic devices.

On a mother board, a semiconductor integrated circuit including the thinfilm transistor in Embodiment 1 or Embodiment 2 is mounted. Asemiconductor integrated circuit is manufactured by mounting a logiccircuit, a flash memory circuit, an SRAM circuit, a DRAM circuitdescribed in Embodiment 6, and the like. Further, the CPU described inEmbodiment 3 can be mounted as well. Note that the semiconductorintegrated circuit can be mounted by a wire bonding method. In thiscase, integrated circuit films having various shapes can be mounted.

In addition, an FPC is attached to the circuit board, through whichdisplay devices or the like is connected thereto. The circuit board canform a driver and a controller of a display portion. The driver in thedisplay portion includes the shift register described in Embodiment 7 orthe EDMOS circuit described in Embodiment 2.

FIG. 18A illustrates a laptop personal computer manufactured by mountingat least a semiconductor integrated circuit as a component, whichincludes a main body 3001, a housing 3002, a display portion 3003, akeyboard 3004, and the like. The laptop personal computer includes theCPU described in Embodiment 3, the DRAM circuit described in Embodiment6, or the like.

FIG. 18B is a portable information terminal (PDA) manufactured bymounting at least a semiconductor integrated circuit as a component,which includes a display portion 3023, an external interface 3025, anoperation button 3024, and the like in a main body 3021. A stylus 3022is included as an accessory for operation.

FIG. 18C is an electronic paper manufactured by mounting at least asemiconductor integrated circuit as a component. An electronic paper canbe used for electronic appliances of a variety of fields as long as theycan display data. For example, an electronic paper can be applied to ane-book reader (electronic book), a poster, an advertisement in a vehiclesuch as a train, displays of various cards such as a credit card, or thelike. FIG. 18C illustrates an example of an electronic book reader. Forexample, the e-book reader 2700 includes two housings: a housing 2701and a housing 2703. The housing 2701 and the housing 2703 are combinedwith a hinge 2711 so that the e-book reader 2700 can be opened andclosed with the hinge 2711 as an axis. With such a structure, the e-bookreader 2700 can operate like a paper book.

A display portion 2705 and a display portion 2707 are incorporated inthe housing 2701 and the housing 2703, respectively. The display portion2705 and the display portion 2707 may display one image or differentimages. In the case where the display portion 2705 and the displayportion 2707 display different images, for example, a display portion onthe right (the display portion 2705 in FIG. 18C) can display text and adisplay portion on the left (the display portion 2707 in FIG. 18C) candisplay graphics.

FIG. 18C illustrates an example in which the housing 2701 is providedwith an operation portion and the like. For example, the housing 2701 isprovided with a power switch 2721, an operation key 2723, a speaker2725, and the like. With the operation key 2723, pages can be turned.Note that a keyboard, a pointing device, or the like may also beprovided on the surface of the housing, on which the display portion isprovided. Furthermore, an external connection terminal (an earphoneterminal, a USB terminal, a terminal that can be connected to variouscables such as an AC adapter and a USB cable, or the like), a recordingmedium insertion portion, and the like may be provided on the backsurface or the side surface of the housing. Moreover, the e-book reader2700 may have a function of an electronic dictionary.

The e-book reader 2700 may have a configuration capable of wirelesslytransmitting and receiving data. Through wireless communication, desiredbook data or the like can be purchased and downloaded from an electronicbook server.

FIG. 18D is a cellular phone manufactured by mounting at least asemiconductor integrated circuit as a component, which includes twohousings: a housing 2800 and a housing 2801. The housing 2801 includes adisplay panel 2802, a speaker 2803, a microphone 2804, a pointing device2806, a camera lens 2807, an external connection terminal 2808, and thelike. The housing 2800 includes a solar battery cell 2810 for chargingof the portable information terminal, an external memory slot 2811, andthe like. Further, an antenna is incorporated in the housing 2801.

The display panel 2802 is provided with a touch panel. A plurality ofoperation keys 2805 which is displayed as images is illustrated bydashed lines in FIG. 18D. Note that the display panel 2802 is mountedwith a booster circuit (the booster circuit described in Embodiment 8)for raising a voltage output from the solar battery cell 2810 to avoltage needed for each circuit.

Further, in addition to the above structure, a contactless IC chip, asmall memory device, or the like described in Embodiment 4 or Embodiment5 may be incorporated.

In the display panel 2802, the display direction can be appropriatelychanged depending on a usage pattern. Further, the display device isprovided with the camera lens 2807 on the same surface as the displaypanel 2802, and thus it can be used as a video phone. The speaker 2803and the microphone 2804 can be used for videophone calls, recording andplaying sound, and the like as well as voice calls. Moreover, thehousings 2800 and 2801 in a state where they are developed asillustrated in FIG. 18D can shift by sliding so that one is lapped overthe other; therefore, the size of the cellular phone can be reduced,which makes the cellular phone suitable for being carried.

The external connection terminal 2808 can be connected to an AC adaptorand a variety of cables such as a USB cable, whereby charging and datacommunication with a personal computer or the like are possible.Furthermore, a large amount of data can be stored and moved by insertinga recording medium into the external memory slot 2811.

Further, in addition to the above functions, an infrared communicationfunction, a television reception function, or the like may be provided.

FIG. 18E is a digital camera manufactured by mounting at least asemiconductor integrated circuit as a component, which includes a mainbody 3051, a display portion (A) 3057, an eyepiece 3053, operationswitches 3054, a display portion (B) 3055, a battery 3056, and the like.

This embodiment can be freely combined with any one of Embodiments 1 to8.

This application is based on Japanese Patent Application serial no.2009-238885 filed with Japan Patent Office on Oct. 16, 2009, the entirecontents of which are hereby incorporated by reference.

1. A semiconductor device comprising: a substrate; a first conductivelayer over the substrate; an insulating layer over the first conductivelayer; and a thin film transistor, wherein the thin film transistorcomprises: a first gate electrode layer; a first gate insulating layer;an oxide semiconductor layer adjacent to the first gate electrode layerwith the first gate insulating layer interposed therebetween; and asecond conductive layer and a third conductive layer electricallyconnected to the oxide semiconductor layer, wherein the oxidesemiconductor layer comprises an intrinsic or substantially intrinsicoxide semiconductor, wherein the oxide semiconductor layer comprisesmicrocrystalline portions, and wherein the insulating layer is providedbetween the first conductive layer and one of the second conductivelayer and the third conductive layer.
 2. The semiconductor deviceaccording to claim 1, wherein the thin film transistor furthercomprises: a second gate insulating layer; and a second gate electrodelayer adjacent to the oxide semiconductor layer with the second gateinsulating layer therebetween.
 3. The semiconductor device according toclaim 1, further comprising a fourth conductive layer electricallyconnected to one of the second conductive layer and the third conductivelayer, wherein the fourth conductive layer overlaps with the firstconductive layer and the insulating layer.
 4. The semiconductor deviceaccording to claim 1, wherein the oxide semiconductor layer contains In,Ga, and Zn.
 5. The semiconductor device according to claim 1, wherein anoff-current value of the thin film transistor is less than or equal to1×10⁻¹³ A.
 6. The semiconductor device according to claim 1, wherein thesemiconductor device is a CPU.
 7. The semiconductor device according toclaim 1, wherein the semiconductor device is an LSI.
 8. Thesemiconductor device according to claim 1, wherein the semiconductordevice is a DRAM.
 9. A semiconductor device comprising: an antenna; anda semiconductor integrated circuit, wherein the semiconductor integratedcircuit comprises: a first conductive layer; an insulating layer overthe first conductive layer; a second conductive layer overlapping withthe first conductive layer through the insulating layer; and a thin filmtransistor comprising an oxide semiconductor layer, wherein the secondconductive layer is electrically connected to the oxide semiconductorlayer, wherein the oxide semiconductor layer comprises an intrinsic orsubstantially intrinsic oxide semiconductor, and wherein the oxidesemiconductor layer comprises microcrystalline portions.
 10. Thesemiconductor device according to claim 9, wherein the oxidesemiconductor layer contains In, Ga, and Zn.
 11. The semiconductordevice according to claim 9, wherein an off-current value of the thinfilm transistor is less than or equal to 1×10⁻¹³ A.
 12. Thesemiconductor device according to claim 9, wherein the semiconductorintegrated circuit is a CPU.
 13. The semiconductor device according toclaim 9, wherein the semiconductor integrated circuit is an LSI.
 14. Thesemiconductor device according to claim 9, wherein the semiconductorintegrated circuit is a DRAM.
 15. The semiconductor device according toclaim 9, wherein the semiconductor device is an electronic book.
 16. Thesemiconductor device according to claim 9, wherein the semiconductordevice is a cellular phone.